| |
FR-4 Standard Technology |
FR-4 Advanced Technology |
Non-FR-4 Standard Technology |
Non-FR-4 Advanced Technology |
Comments |
| Layer Count |
50 |
60 |
50 |
60 |
|
| Minimum Drilled hole diameter |
.008"* |
.0059"* |
.008"* |
.0059"* |
*Restrictions apply, engineering review of specific design required. |
| Maximum Thickness |
.250" |
.280" |
.250" |
.280" |
|
| Thickness Tolerance |
+/- 7% |
+/- 5% |
+/- 7% |
+/- 5% |
|
| Maximum Aspect Ratio |
25:1 |
32:1* |
16:1 |
20:1* |
*Restrictions apply, engineering review of specific design required. |
| PTH copper plating |
.0008" min |
.0008" min |
.0008" min |
.0008" min |
|
| Nickel plating |
100 - 350 microinchs |
100 - 350 microinchs |
100 - 350 microinchs |
100 - 350 microinchs |
|
| Gold plating |
30 - 80 microinches |
30 - 80 microinches |
30 - 80 microinches |
30 - 80 microinches |
|
| Controlled Depth Drilling tolerance (Blind Via) |
+/- .002" |
+/- .001" |
+/- .002" |
+/- .001" |
|
| Minimum Pad, Inner Layer Annular Ring (Tangency) |
.012" Over Drill (.006" per side) |
.010" Over Drill (.005" per side) |
.012" Over Drill (.006" per side) |
.010" Over Drill (.005" per side) |
0.5mm pitch DUT designs require a pad size of .006" above drill size. This may result in breakout in these areas. |
| Minimum Pad, Outer Layer Annular Ring (Tangency) |
.012" Over Drill (.006" per side) |
.010" Over Drill (.005" per side) |
.012" Over Drill (.006" per side) |
.010" Over Drill (.005" per side) |
0.5mm pitch DUTdesigns require a pad size of .006" above drill size. This may result in breakout in these areas. |
| Anti-Pad requirement near the perimeter of the panel |
.030" Over Drill (.015" per side) |
.020" Over Drill (.010" per side) |
.030" Over Drill (.015" per side) |
.020" Over Drill (.010" Per side) |
0.5mm pitch DUT designs require a pad size of .006" above drill size. This may result in breakout in these areas. |
| Anti-Pad in LGA/DUT (Center of Panel) Area |
.016" Over Drill (.008" per side)* |
.010" Over Drill (.005" per side)* |
.016" Over Drill (.008" per side)* |
.010" Over Drill (.005" per side)* |
* Restrictions apply, engineering review of design required. |
| Min. Drill Size for single pass drill, .250" thick panel |
.016" |
.016" |
.016" |
.016" |
|
| Min. Drill Size for single pass drill, .187" thick panel |
.012" |
.012" |
.012" |
.012" |
|
| Min. Drill Size for single pass drill, .125" thick panel |
0.010" |
.010" |
.010" |
.010" |
|
| Min. Drill Size for single pass drill, .093" thick panel |
.006" |
.006" |
.006" |
.006" |
|
| Trace to Drilled hole Airgap |
.007" |
.005" |
.008" |
.006" |
|
| I/L Trace Width & Space, 1/2 Oz Copper |
.0035" |
.003" |
.0035" |
.003" |
|
| I/L Trace Width & Space, 1 Oz Copper |
.004" |
.0035" |
.004" |
.0035" |
|
| O/L Trace Width & Space, 1/2 oz Substrate copper |
.0035" |
.003" |
.0035" |
.003" |
|
| O/L Trace Width & Space, 1 Oz Substrate Copper |
.004" |
.0035" |
.004" |
.0035" |
|
| Copper to Rout, signal |
.010" |
.008" |
.010" |
.008" |
|
| Copper to Rout, plane |
.012" |
.008" |
.012" |
.008" |
|
| NPTH to circuit, signal |
.012" |
.010" |
.012" |
.010" |
|
| Text, signal |
.008" |
.006" |
.008" |
.006" |
|
| Text to Text, signal |
.006' |
.004" |
.006" |
.004' |
|
| NPTH to Circuit, plane |
.018" |
.0149" |
.018" |
.0149" |
|
| Plane Spacing |
.012" |
.008" |
.012" |
.008" |
|
| Impedance Control, Single Ended |
+/- 10% |
+/- 5%* |
+/- 10% |
+/- 5%* |
All 5% impedance orders require engineering approval of specific design. |
| Impedance Control, Differential pairs |
+/- 10% |
+/- 5%* |
+/-10% |
+/- 5%* |
* Restrictions apply, engineering review of specific design required. |
| Drilled hole to hole True Position |
+/- .002" |
+/- .001"* |
+/- .002" |
+/- .001"* |
* Restrictions apply, engineering review of specific design required. |
| Drilled tooling hole to Imaged Feature True Position |
+/- .002" |
+/- .001" |
+/- .002" |
+/- .001" |
|
| Flatness |
.005"/Inch |
.003"/Inch* |
.007"/Inch |
.005"/Inch |
|
| Electrical Test, Insulation Resistance |
100 megaohms at 500 V |
100 megaohms at 500 V |
100 megaohms at 500 V |
100 megaohms at 500 V |
|
| Electrical Test, Leakage |
1K nanoamps (tested at 100 V & 100 megaohms |
109 nanoamps (tested at 131 V & 1.2 gigaohms)* |
1K nanoamps (tested at 100 V & 100 megaohms |
109 nanoamps (tested at 131 V & 1.2 gigaohms)* |
* Outside test service required. |
| Electrical Test, Continuity |
10 ohms |
5 ohms* |
10 ohms |
5 ohms* |
* Restrictions apply, engineering review of specific design required. |
| Hi-Pot Leakage Testing |
500V |
1000V |
500V |
1000V |
|
| Fabrication Tolerances |
+/- .005" |
+/- .003" |
+/- .005" |
+/- .003" |
|
| Solder Mask Clearance |
.003" per side |
.002" per side |
.003" per side |
.002" per side |
|
| Minimum Solder Mask Web width |
.005" |
.003" |
.005" |
.003" |
|
| Ionic Contamination (Bare board) |
7 micrograms/sq. in. Eq. NaCl |
7 micrograms/sq. in. Eq. NaCl |
7 micrograms/sq. in. Eq. NaCl |
7 micrograms/sq. in. Eq. NaCl |
|
| Ionic Contamination (Assembled board). |
7 micrograms/sq. in. Eq. NaCl |
7 micrograms/sq. in. Eq. NaCl |
7 micrograms/sq. in. Eq. NaCl |
7 micrograms/sq. in. Eq. NaCl |
|
| Dryfilm solder mask tenting |
.020" Max Hole Size |
.015" Max Hole Size |
.020" Max Hole Size |
.015" Max Hole Size |
Advanced Technology requires 2 mil thick Dryfilm solder mask. |
| Min. Legend trace width |
.006" |
.004" |
.006" |
.004" |
|
| Min. Pad to Legend Spacing |
.003" |
.002" |
.003" |
.002" |
|
| Standard Technology |
Manufacturable with Standard Operating Procedures |
|
| Advanced Technology |
Manufacturable with Engineering Support |
|
