TECHNOLOGY ROADMAP 2004-2007
1/19/2004
.0197" pitch
.187" thick pcb
.006" drilled hole
Top/Bottom drill required
31:1 aspect ratio
.010 pad size
.016" plane clearance
.0035" trace width
.0031" pad to trace space
12/2005
.0157" pitch
.187" thick pcb
.004" drilled hole
Blind via required
.060" max. thick blind sub
Via fill required
.008" pad size
.011" plane clearance
.0025" trace width
.0026" pad to trace space
12/2007
.0118" pitch
.187" thick pcb
.002" drilled hole
Blind via required
.020" max. thick blind sub
Via fill required
.006" pad size
.009" plane clearance
.002" trace width
.0019" pad to trace space
Technology Roadblocks
Increased spindle speed drill capability
Collimated light imaging
Mixed surface finish
Material dimensional stability
Dielectric thickness control
Sequential lamination capacity
12/1/2005
Technology Roadblocks
Laser ablation
Direct laser imaging
Pulse copper plating
Material dimensional stabillity
Dielectric thickness control
12/1/2007
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